There is a spelling mistake in a dev_err error message. Fix it.

Signed-off-by: Colin Ian King <colin.king@canonical.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20200130100537.18069-1-colin.king@canonical.com

Sphinx ('make htmldocs') stops with a SEVERE error:

Sphinx parallel build error:
SystemMessage: /home/rdunlap/lnx/next/linux-next-20200120/Documentation/driver-api/thermal/cpu-idle-cooling.rst:69: (SEVERE/4) Unexpected section title.

^
|

so fix the .rst file so that the SEVERE build error does not happen.
Also fix another minor formatting warning (unexpected unindent).

Signed-off-by: Randy Dunlap <rdunlap@infradead.org>
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Daniel Lezcano <daniel.lezcano@linaro.org>
Cc: Amit Kucheria <amit.kucheria@verdurent.com>
Cc: linux-pm@vger.kernel.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/712c1152-56b5-307f-b3f3-ed03a30b804a@infradead.org

With the STM32 thermal peripheral, it is not possible to dump the
temperature that has caused the interrupt.
When the temperature reaches the low threshold, we generally read
a temperature that is a little bit higher than the low threshold.
This maybe due to sampling precision, and also because the CPU becomes
hotter when it quits WFI mode.
In that case, the framework does not change the trip points. This leads
to a lot of low threshold interrupts.

The fix is to set the low threshold value 0.5 degrees Celsius
below the actual request.

The problem is not so frequent with the high threshold and it would
no be a good idea to set the threshold value higher than the request.

Signed-off-by: Pascal Paillet <p.paillet@st.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20200110101605.24984-7-p.paillet@st.com

Change the way of computing to avoid rounds by 1 or 2 degrees.
Also simplify the sampling time management that is hard-coded
to maximum value during probe.

Signed-off-by: Pascal Paillet <p.paillet@st.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20200110101605.24984-6-p.paillet@st.com

Let the thermal framework handle the trip points instead
of custom code inside the driver. This is backward compatible,
simplifies the driver and offers the possibility to the user
to set any trip point he needs.

stm_thermal_set_trips callback that is registered to
set_trips ops to handle the low and high thresholds and replaces
stm_thermal_set_threshold and stm_thermal_update_threshold functions.
modify irq enable to handle the thresholds.

Signed-off-by: Pascal Paillet <p.paillet@st.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20200110101605.24984-5-p.paillet@st.com

In case of CPU reset, the interrupts could be enabled at boot time.
Disable interrupts and clear flags.

Signed-off-by: Pascal Paillet <p.paillet@st.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20200110101605.24984-4-p.paillet@st.com

Be sure get_temp returns an error while disabling or enabling the device.
Set THERMAL_DEVICE_ENABLED state at the end of power on function.
Set THERMAL_DEVICE_DISABLED state at the beginning of power off function.

Signed-off-by: Pascal Paillet <p.paillet@st.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20200110101605.24984-3-p.paillet@st.com

Fix a mistake with the ICIFR register name.

Signed-off-by: Pascal Paillet <p.paillet@st.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20200110101605.24984-2-p.paillet@st.com

When devm_thermal_zone_of_sensor_register() is called from
hwmon_thermal_add_sensor() it is possible that the relevant sensor is
missing an OF node. In this case thermal_zone_of_sensor_register() returns
-EINVAL which causes hwmon_thermal_add_sensor() to fail as well. This patch
changes relevant return code of thermal_zone_of_sensor_register() to
-ENODEV, which is tolerated by hwmon_thermal_add_sensor().

Here is a particular case of such behaviour: the Marvell ethernet PHYs
driver registers hwmon device for the built-in temperature sensor (see
drivers/net/phy/marvell.c). Since the sensor doesn't have associated OF
node devm_hwmon_device_register() returns error which ultimately causes
failure of the PHY driver's probe function.

Signed-off-by: Peter Mamonov <pmamonov@gmail.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20190827143952.19591-1-pmamonov@gmail.com

The hardware manual states that the operation of the sensor is not
guaranteed with temperatures above 125°C, not that the readings are
invalid. Remove the bound check and try to deliver temperature readings
even if we are outside the guaranteed operation range.

Signed-off-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20200117160554.3812787-3-niklas.soderlund+renesas@ragnatech.se

The hardware manual states that the operation of the sensor is not
guaranteed outside the range of -45°C to 125°C, not that the readings
are invalid. Remove the bound check and try to deliver temperature
readings even if we are outside the guaranteed operation range.

Signed-off-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20200117160554.3812787-2-niklas.soderlund+renesas@ragnatech.se

Add Comet Lake to the list of the platforms to support intel_pch_thermal
driver.

Cc: Zhang rui <rui.zhang@intel.com>
Cc: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Signed-off-by: Gayatri Kammela <gayatri.kammela@intel.com>
Acked-by: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20191211200043.4985-1-gayatri.kammela@intel.com

The driver calls pci_request_regions() in probe and uses
pci_release_regions() in probe failure.
However, it calls pci_release_region() in remove, which does
match the other two calls.
Use pci_release_regions() instead to unify them.

Signed-off-by: Chuhong Yuan <hslester96@gmail.com>
Acked-by: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20191206075531.18637-1-hslester96@gmail.com

Added new PCI id for Jasper Lake processor thermal device.

Signed-off-by: Swaminathan, Nivedita <nivedita.swaminathan@intel.com>
Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Acked-by: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20191212203025.36310-1-srinivas.pandruvada@linux.intel.com

Drop the reg property since this only necessary for the parent and
add the missing thermal-sensor-cells property description.

Signed-off-by: Stefan Wahren <stefan.wahren@i2se.com>
Fixes: 37e9cc08e9678 ("dt-bindings: Add Broadcom AVS RO thermal")
Reviewed-by: Rob Herring <robh@kernel.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/1579200077-17496-1-git-send-email-stefan.wahren@i2se.com

Since we do not have interrupts on BCM7216, we cannot have trip point
crossing, the thermal subsystem expects us to provide a NULL set_trips
operation in that case, so make it possible to provide per-process
thermal_zone_of_device_ops

Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org>
Signed-off-by: Florian Fainelli <f.fainelli@gmail.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20200114190607.29339-7-f.fainelli@gmail.com

If we are successful grabbing the interrupt resource, then register an
interrupt handler, this makes it easier to support the interrupt as
being optional, which is it for 7216.

Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org>
Signed-off-by: Florian Fainelli <f.fainelli@gmail.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20200114190607.29339-6-f.fainelli@gmail.com

Match the 7216 compatible string in order to derive the correct 16nm
process thermal parameters to obtain correct readings.

Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org>
Signed-off-by: Florian Fainelli <f.fainelli@gmail.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20200114190607.29339-5-f.fainelli@gmail.com

BCM7216 is a 16nm process STB chip, which requires a different
compatible string to differentiate different temperature formulas.

Reviewed-by: Rob Herring <robh@kernel.org>
Signed-off-by: Florian Fainelli <f.fainelli@gmail.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20200114190607.29339-4-f.fainelli@gmail.com

The driver is currently assuming that it is operating with a 28nm
process chip, which has a specific formula to convert temperature to a
code and vice versa. Update the code to support providing two key
values: offset and multiplier to derive the correct formulas.

Signed-off-by: Florian Fainelli <f.fainelli@gmail.com>
Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20200114190607.29339-3-f.fainelli@gmail.com

At the time the brcmstb_thermal driver and its binding were merged, the
DT binding did not make the coefficients properties a mandatory one,
therefore all users of the brcmstb_thermal driver out there have a non
functional implementation with zero coefficients. Even if these
properties were provided, the formula used for computation is incorrect.

The coefficients are entirely process specific (right now, only 28nm is
supported) and not board or SoC specific, it is therefore appropriate to
hard code them in the driver given the compatibility string we are
probed with which has to be updated whenever a new process is
introduced.

We remove the existing coefficients definition since subsequent patches
are going to add support for a new process and will introduce new
coefficients as well.

Fixes: 9e03cf1b ("thermal: add brcmstb AVS TMON driver")
Signed-off-by: Florian Fainelli <f.fainelli@gmail.com>
Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20200114190607.29339-2-f.fainelli@gmail.com

rcar_thermal_update_temp() takes a mutex, so it is always called in a
context that can sleep.  Hence replace the 300 µs busy loop by a call to
usleep_range(), to allow other threads to run.

Signed-off-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20200115125417.5263-1-geert+renesas@glider.be

This builds the BCM2711 thermal driver as module for the Raspberry Pi 4.

Signed-off-by: Stefan Wahren <stefan.wahren@i2se.com>
Reviewed-by: Florian Fainelli <f.fainelli@gmail.com>
Reviewed-by: Nicolas Saenz Julienne <nsaenzjulienne@suse.de>
Tested-by: Nicolas Saenz Julienne <nsaenzjulienne@suse.de>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/1578941778-23321-5-git-send-email-stefan.wahren@i2se.com

This enables thermal for the BCM2711 (used on Raspberry Pi 4) by adding
the AVS monitor and a subnode for the thermal part.

Signed-off-by: Stefan Wahren <stefan.wahren@i2se.com>
Reviewed-by: Nicolas Saenz Julienne <nsaenzjulienne@suse.de>
Tested-by: Nicolas Saenz Julienne <nsaenzjulienne@suse.de>
Signed-off-by: Florian Fainelli <f.fainelli@gmail.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/1578941778-23321-4-git-send-email-stefan.wahren@i2se.com

This adds the thermal sensor driver for the Broadcom BCM2711 SoC,
which is placed on the Raspberry Pi 4. The driver only provides
SoC temperature reading so far.

Signed-off-by: Stefan Wahren <stefan.wahren@i2se.com>
Reviewed-by: Florian Fainelli <f.fainelli@gmail.com>
Reviewed-by: Nicolas Saenz Julienne <nsaenzjulienne@suse.de>
Tested-by: Nicolas Saenz Julienne <nsaenzjulienne@suse.de>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/1578941778-23321-3-git-send-email-stefan.wahren@i2se.com

Since the BCM2711 doesn't have a AVS TMON block, the thermal information
must be retrieved from the AVS ring oscillator block. This block is part
of the AVS monitor which contains a bunch of raw sensors.

Signed-off-by: Stefan Wahren <stefan.wahren@i2se.com>
Reviewed-by: Rob Herring <robh@kernel.org>
Reviewed-by: Nicolas Saenz Julienne <nsaenzjulienne@suse.de>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/1578941778-23321-2-git-send-email-stefan.wahren@i2se.com

Expose sun8i thermal as a HWMON device.

Signed-off-by: Yangtao Li <tiny.windzz@gmail.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20191228171904.24618-1-tiny.windzz@gmail.com

The cp_ft_flag variable is not used after initialization, so delete
it. After that, THS_EFUSE_CP_FT_MASK, THS_EFUSE_CP_FT_BIT and
THS_CALIBRATION_IN_FT are not needed, so delete them.

Signed-off-by: Yangtao Li <tiny.windzz@gmail.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20200112180925.23705-1-tiny.windzz@gmail.com

sparse returns a warning:

"drivers/thermal/sun8i_thermal.c:341:60: sparse: sparse: Using plain
integer as NULL pointer".

Fix it by replacing the zero integer by a NULL pointer.

Reported-by: kbuild test robot <lkp@intel.com>
Signed-off-by: Yangtao Li <tiny.windzz@gmail.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20200112171318.23025-1-tiny.windzz@gmail.com

According to the spec, r40 has 2 thermal sensors.
Sensor0 located in the CPU, another in the GPU.

Fixes: dccc5c3b ("thermal/drivers/sun8i: Add thermal driver for H6/H5/H3/A64/A83T/R40")
Signed-off-by: Yangtao Li <tiny.windzz@gmail.com>
Tested-by: Corentin Labbe <clabbe.montjoie@gmail.com>
Tested-on: sun8i-r40-bananapi-m2-ultra
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20200106174639.20862-1-tiny.windzz@gmail.com

Fix up inconsistent usage of upper and lowercase letters in "Samsung"
and "Exynos" names.

"SAMSUNG" and "EXYNOS" are not abbreviations but regular trademarked
names.  Therefore they should be written with lowercase letters starting
with capital letter.

The lowercase "Exynos" name is promoted by its manufacturer Samsung
Electronics Co., Ltd., in advertisement materials and on website.

Although advertisement materials usually use uppercase "SAMSUNG", the
lowercase version is used in all legal aspects (e.g. on Wikipedia and in
privacy/legal statements on
https://www.samsung.com/semiconductor/privacy-global/

).

Signed-off-by: Krzysztof Kozlowski <krzk@kernel.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20200104152107.11407-7-krzk@kernel.org

Since commit d36e2fa0 ("thermal: generic-adc: make lookup table
optional") "generic-adc-thermal" can be used with an IIO_TEMP channel.
In this case the following message is logged at probe time:
  no lookup table, assuming DAC channel returns milliCelcius

Silence this info message if the channel type is known to be in
milli celsius. Keep this message when the channel type is unknown or not
of type temperature.

Signed-off-by: Martin Blumenstingl <martin.blumenstingl@googlemail.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20200107232044.889075-3-martin.blumenstingl@googlemail.com

A "generic-adc-thermal" without "temperature-lookup-table" is perfectly
valid since commit d36e2fa0 ("thermal: generic-adc: make lookup
table optional"). On deferred probe the message "no lookup table,
assuming DAC channel returns milliCelcius" is still logged.
Prevent this message on deferred probe of the IIO channel by first
looking up the IIO channel.

Signed-off-by: Martin Blumenstingl <martin.blumenstingl@googlemail.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20200107232044.889075-2-martin.blumenstingl@googlemail.com

sun8i-thermal driver supports thermal sensor in wide range of Allwinner
SoCs. Add YAML schema for its bindings.

Signed-off-by: Yangtao Li <tiny.windzz@gmail.com>
Signed-off-by: Vasily Khoruzhick <anarsoul@gmail.com>
Acked-by: Maxime Ripard <mripard@kernel.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20191219172823.1652600-3-anarsoul@gmail.com

This patch adds the support for allwinner thermal sensor, within
allwinner SoC. It will register sensors for thermal framework
and use device tree to bind cooling device.

Signed-off-by: Yangtao Li <tiny.windzz@gmail.com>
Signed-off-by: Ondrej Jirman <megous@megous.com>
Signed-off-by: Vasily Khoruzhick <anarsoul@gmail.com>
Acked-by: Maxime Ripard <mripard@kernel.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20191219172823.1652600-2-anarsoul@gmail.com

The function of_thermal_free_zone() is only used the initialization
function which all belonging to the init section.

Move it also to the __init section.

Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20191219222154.16100-2-daniel.lezcano@linaro.org

The function of_thermal_destroy_zones() is only used internally by the
of_parse_thermal_zones() for rollbacking in case of error.

Make it static and tag it as an __init function.

Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20191219222154.16100-1-daniel.lezcano@linaro.org

As we introduced the idle injection cooling device called
cpuidle_cooling, let's be consistent and rename the cpu_cooling to
cpufreq_cooling as this one mitigates with OPPs changes.

Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Acked-by: Viresh Kumar <viresh.kumar@linaro.org>
Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org>
Link: https://lore.kernel.org/r/20191219225317.17158-3-daniel.lezcano@linaro.org

The cpu idle cooling device offers a new method to cool down a CPU by
injecting idle cycles at runtime.

It has some similarities with the intel power clamp driver but it is
actually designed to be more generic and relying on the idle injection
powercap framework.

The idle injection duration is fixed while the running duration is
variable. That allows to have control on the device reactivity for the
user experience.

An idle state powering down the CPU or the cluster will allow to drop
the static leakage, thus restoring the heat capacity of the SoC. It
can be set with a trip point between the hot and the critical points,
giving the opportunity to prevent a hard reset of the system when the
cpufreq cooling fails to cool down the CPU.

With more sophisticated boards having a per core sensor, the idle
cooling device allows to cool down a single core without throttling
the compute capacity of several cpus belonging to the same clock line,
so it could be used in collaboration with the cpufreq cooling device.

Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Acked-by: Viresh Kumar <viresh.kumar@linaro.org>
Link: https://lore.kernel.org/r/20191219225317.17158-2-daniel.lezcano@linaro.org

Provide some documentation for the idle injection cooling effect in
order to let people to understand the rational of the approach for the
idle injection CPU cooling device.

Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Acked-by: Viresh Kumar <viresh.kumar@linaro.org>
Link: https://lore.kernel.org/r/20191219225317.17158-1-daniel.lezcano@linaro.org