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Commit 4ba115b1 authored by Eduardo Valentin's avatar Eduardo Valentin Committed by Zhang Rui
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thermal: cpu cooling: allow module builds



As thermal drivers can be built as modules and also
the thermal framework itself, building cpu cooling
only as built-in can cause linking errors. For instance:
* Generic Thermal sysfs driver
*
Generic Thermal sysfs driver (THERMAL) [M/n/y/?] m
  generic cpu cooling support (CPU_THERMAL) [N/y/?] (NEW) y

with the following drive:
CONFIG_OMAP_BANDGAP=m

generates:
ERROR: "cpufreq_cooling_unregister" [drivers/staging/omap-thermal/omap-thermal.ko] undefined!
ERROR: "cpufreq_cooling_register" [drivers/staging/omap-thermal/omap-thermal.ko] undefined!

This patch changes cpu cooling driver to allow it
to be built as module.

Reported-by: default avatarEnric Balletbo i Serra <eballetbo@gmail.com>
Signed-off-by: default avatarEduardo Valentin <eduardo.valentin@ti.com>
Reviewed-by: default avatarDurgadoss R <durgadoss.r@intel.com>
Signed-off-by: default avatarZhang Rui <rui.zhang@intel.com>
parent 3778ff5c
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