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Commit a8d0d841 authored by David S. Miller's avatar David S. Miller
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Merge branch 'bond_stacked_vlans'

Vlad Yasevich says:

====================
Fixed stacked vlan usage on top of bonds

Bonding device driver now support q-in-q on top for bonds.  There are
a few issues here though.

First, when arp monitoring is used, bonding driver will not correctly
tag traffic if the source of the arp device was configured on top of
q-in-q.  It may also incorrectly pick the wrong vlan id if the ordering
of that upper devices isn't as expected (there is no guarntee on ordering).

Second, the alb/tlb may use what would be considered 'inner' vlans in
its learning announcements, as it simply announces all vlans configured
on top of the bond without regard for encapsulation/stacking.

This series fixes the above 2 issues.  This series also depends on the
functionality introduced in
	http://patchwork.ozlabs.org/patch/349766/



Since v1:
  - Changed how patch1 verifies the device path.  We no longer use the
    _all_upper version of the function.  We find the path and if it was
    found, then collect the vlan information.
  - Use the constant to devine maximum vlan nest level support on top
    of bonding.  This can be changed if 2 is too low.
  - Inlude patch2 into the series.
====================

Signed-off-by: default avatarDavid S. Miller <davem@davemloft.net>
parents 6bd64ac0 f60c3704
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