ARM: dts: omap3: Add support for IGEP COM Module

ISEE IGEP COM Module is an TI OMAP3 SoC computer on module.

This patch adds an initial device tree support to boot an
IGEP COM Module from the MMC/SD.

Signed-off-by: Javier Martinez Canillas <javier.martinez@collabora.co.uk>
Tested-by: Enric Balletbo i Serra <eballetbo@gmail.com>
[b-cousson@ti.com: Update the Makefile for 3.8-rc2]
Signed-off-by: Benoit Cousson <benoit.cousson@linaro.org>