arm64: dts: exynos: Add dtsi files for Samsung Exynos5433 64bit SoC
This patch adds new Exynos5433 dtsi to support 64-bit Exynos5433 SoC based on Octa-core CPUs (quad Cortex-A57 and quad Cortex-A53). Exynos5433 supports PSCI (Power State Coordination Interface) v0.1. This patch includes following Device Tree nodes to support Exynos5433 SoC: 1. Octa cores for big.LITTLE architecture - Cortex-A53 LITTLE Quad-core - Cortex-A57 big Quad-core - Supporting PSCI v0.1 2. Clock controller nodes - CMU_TOP : clocks for IMEM/FSYS/G3D/GSCL/HEVC/MSCL/G2D/MFC/PERIC/PERIS - CMU_CPIF : clocks for LLI (Low Latency Interface) - CMU_MIF : clocks for DRAM Memory Controller - CMU_PERIC : clocks for UART/I2C/SPI/I2S/PCM/SPDIF/PWM/SLIMBUS - CMU_PERIS : clocks for PMU/TMU/MCT/WDT/RTC/SECKEY/TZPC - CMU_FSYS : clocks for USB/UFS/SDMMC/TSI/PDMA - CMU_G2D : clocks for G2D/MDMA - CMU_DISP : clocks for DECON/HDMI/DSIM/MIXER - CMU_AUD : clocks for Cortex-A5/BUS/AUDIO - CMU_BUS{0|1|2} : clocks for global data buses and global peripheral buses - CMU_G3D : clocks for 3D Graphics Engine - CMU_GSCL : clocks for GSCALER - CMU_APOLLO: clocks for Cortex-A53 Quad-core processor. - CMU_ATLAS : clocks for Cortex-A57 Quad-core processor, CoreSight and L2 cache controller. - CMU_MSCL : clocks for M2M (Memory to Memory) scaler and JPEG IPs. - CMU_MFC : clocks for MFC (Multi-Format Codec) IP. - CMU_HEVC : clocks for HEVC(High Efficiency Video Codec) decoder IP. - CMU_ISP : clocks for FIMC-ISP/DRC/SCLC/DIS/3DNR IPs. - CMU_CAM0 : clocks for MIPI_CSIS{0|1}/FIMC_LITE_{A|B|D}/FIMC_3AA{0|1} IPs. - CMU_CAM1 : clocks for COrtex-A5/MIPI_CSIS2/FIMC_LITE_C/FIMC-FD IPs. 3. Pinctrl nodes for GPIO - alive/aud/cpif/ese/finger/fsys/imem/nfc/peric/touch pad 4. Timers - ARM architecture timer (armv8-timer) - MCT (Multi Core Timer) timer 5. Interrupt controller (GIC-400) 6. BUS devices - HS-I2C (High-Speed I2C) device - SPI (Serial Peripheral Interface) device 7. Sound devices - I2S bus - LPASS (Low Power Audio Subsystem) 8. Power management devices - CPUFREQ for for Cortex-A53/A57 - TMU (Thermal Management Unit) for Cortex-A53/A57, G3D, ISP 9. Display controller devices - DECON (Display and enhancement controller) for panel output - DSI (Display Serial Interface) - MIC (Mobile Image Compressor) 10. USB - USB 3.0 DRD (Dual Role Device) controller - USB 3.0 Host controller 11. Storage devices - MSHC (Mobile Storage Host Controller) 12. Misc devices - UART devices - ADC (Analog Digital Converter) - PWM (Pulse Width Modulation) - ADMA (Advanced DMA) and PDMA (Peripheral DMA) Signed-off-by:Chanwoo Choi <cw00.choi@samsung.com> Signed-off-by:
Jaehoon Chung <jh80.chung@samsung.com> Signed-off-by:
Seung-Woo Kim <sw0312.kim@samsung.com> Signed-off-by:
Joonyoung Shim <jy0922.shim@samsung.com> Signed-off-by:
Inki Dae <inki.dae@samsung.com> Signed-off-by:
Jonghwa Lee <jonghwa3.lee@samsung.com> Signed-off-by:
Beomho Seo <beomho.seo@samsung.com> Signed-off-by:
Jaewon Kim <jaewon02.kim@samsung.com> Signed-off-by:
Hyungwon Hwang <human.hwang@samsung.com> Signed-off-by:
Inha Song <ideal.song@samsung.com> Signed-off-by:
Ingi kim <ingi2.kim@samsung.com> Signed-off-by:
Marek Szyprowski <m.szyprowski@samsung.com> Signed-off-by:
Andrzej Hajda <a.hajda@samsung.com> Signed-off-by:
Sylwester Nawrocki <s.nawrocki@samsung.com> Reviewed-by:
Javier Martinez Canillas <javier@osg.samsung.com> Tested-by:
Andi Shyti <andi.shyti@samsung.com> Signed-off-by:
Krzysztof Kozlowski <krzk@kernel.org>
parent
1001354c
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