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Commit 4f8d374b authored by Jean-Francois Dagenais's avatar Jean-Francois Dagenais Committed by Guenter Roeck
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hwmon: (max6650) add thermal cooling device capability



This allows max6650 devices to be referenced in dts as a cooling device.

The pwm value seems duplicated in cooling_dev_state but since pwm goes
through rounding logic into data->dac, it is modified and messes with
the thermal zone state algorithms. It's also better to serve a cache
value, thus avoiding periodic actual i2c traffic.

Signed-off-by: default avatarJean-Francois Dagenais <jeff.dagenais@gmail.com>
Signed-off-by: default avatarGuenter Roeck <linux@roeck-us.net>
parent 023912db
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