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Commit 75f74a90 authored by Rafael J. Wysocki's avatar Rafael J. Wysocki
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Pull thermal control material for 6.4-rc1 from Daniel Lezcano:

"- Add more thermal zone device encapsulation: prevent setting
   structure field directly, access the sensor device instead the
   thermal zone's device for trace, relocate the traces in
   drivers/thermal (Daniel Lezcano)

 - Use the generic trip point for the i.MX and remove the get_trip_temp
   ops (Daniel Lezcano)

 - Use the devm_platform_ioremap_resource() in the Hisilicon driver
   (Yang Li)

 - Remove R-Car H3 ES1.* handling as public has only access to the ES2
   version and the upstream support for the ES1 has been shutdown (Wolfram
   Sang)

 - Add a delay after initializing the bank in order to let the time to
   the hardware to initialze itself before reading the temperature
   (Amjad Ouled-Ameur)

 - Add MT8365 support (Amjad Ouled-Ameur)"

* tag 'thermal-v6.4-rc1-1' of ssh://gitolite.kernel.org/pub/scm/linux/kernel/git/thermal/linux:
  thermal/drivers/ti: Use fixed update interval
  thermal/drivers/stm: Don't set no_hwmon to false
  thermal/drivers/db8500: Use driver dev instead of tz->device
  thermal/core: Relocate the traces definition in thermal directory
  thermal/drivers/hisi: Use devm_platform_ioremap_resource()
  thermal/drivers/imx: Use the thermal framework for the trip point
  thermal/drivers/imx: Remove get_trip_temp ops
  thermal/drivers/rcar_gen3_thermal: Remove R-Car H3 ES1.* handling
  thermal/drivers/mediatek: Add delay after thermal banks initialization
  thermal/drivers/mediatek: Add support for MT8365 SoC
  thermal/drivers/mediatek: Control buffer enablement tweaks
  dt-bindings: thermal: mediatek: Add binding documentation for MT8365 SoC
parents cd246fa9 0c492be4
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