Merge branch 'next' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux (aac09ce2) · Commits · 方亚芬 / linux

Documentation/thermal/cpu-cooling-api.txt→Documentation/thermal/cpu-cooling-api.rst

+27 −12

Original line number	Original line	Diff line number	Diff line
			=======================
	CPU cooling APIs How To		CPU cooling APIs How To
	===================================		=======================

	Written by Amit Daniel Kachhap <amit.kachhap@linaro.org>		Written by Amit Daniel Kachhap <amit.kachhap@linaro.org>

	@@ -8,40 +9,54 @@ Updated: 6 Jan 2015
	Copyright (c) 2012 Samsung Electronics Co., Ltd(http://www.samsung.com)		Copyright (c) 2012 Samsung Electronics Co., Ltd(http://www.samsung.com)

	0. Introduction		0. Introduction
			===============

	The generic cpu cooling(freq clipping) provides registration/unregistration APIs		The generic cpu cooling(freq clipping) provides registration/unregistration APIs
	to the caller. The binding of the cooling devices to the trip point is left for		to the caller. The binding of the cooling devices to the trip point is left for
	the user. The registration APIs returns the cooling device pointer.		the user. The registration APIs returns the cooling device pointer.

	1. cpu cooling APIs		1. cpu cooling APIs
			===================

	1.1 cpufreq registration/unregistration APIs		1.1 cpufreq registration/unregistration APIs
	1.1.1 struct thermal_cooling_device *cpufreq_cooling_register(		--------------------------------------------
	struct cpumask *clip_cpus)
			::

			struct thermal_cooling_device
			cpufreq_cooling_register(struct cpumask clip_cpus)

	This interface function registers the cpufreq cooling device with the name		This interface function registers the cpufreq cooling device with the name
	"thermal-cpufreq-%x". This api can support multiple instances of cpufreq		"thermal-cpufreq-%x". This api can support multiple instances of cpufreq
	cooling devices.		cooling devices.

	clip_cpus: cpumask of cpus where the frequency constraints will happen.		clip_cpus:
			cpumask of cpus where the frequency constraints will happen.

			::

	1.1.2 struct thermal_cooling_device *of_cpufreq_cooling_register(		struct thermal_cooling_device
	struct cpufreq_policy *policy)		of_cpufreq_cooling_register(struct cpufreq_policy policy)

	This interface function registers the cpufreq cooling device with		This interface function registers the cpufreq cooling device with
	the name "thermal-cpufreq-%x" linking it with a device tree node, in		the name "thermal-cpufreq-%x" linking it with a device tree node, in
	order to bind it via the thermal DT code. This api can support multiple		order to bind it via the thermal DT code. This api can support multiple
	instances of cpufreq cooling devices.		instances of cpufreq cooling devices.

	policy: CPUFreq policy.		policy:
			CPUFreq policy.


			::

	1.1.3 void cpufreq_cooling_unregister(struct thermal_cooling_device *cdev)		void cpufreq_cooling_unregister(struct thermal_cooling_device *cdev)

	This interface function unregisters the "thermal-cpufreq-%x" cooling device.		This interface function unregisters the "thermal-cpufreq-%x" cooling device.

	cdev: Cooling device pointer which has to be unregistered.		cdev: Cooling device pointer which has to be unregistered.

	2. Power models		2. Power models
			===============

	The power API registration functions provide a simple power model for		The power API registration functions provide a simple power model for
	CPUs. The current power is calculated as dynamic power (static power isn't		CPUs. The current power is calculated as dynamic power (static power isn't
	@@ -65,7 +80,7 @@ For a given processor implementation the primary factors are:
	variation. In pathological cases this variation can be significant,		variation. In pathological cases this variation can be significant,
	but typically it is of a much lesser impact than the factors above.		but typically it is of a much lesser impact than the factors above.

	A high level dynamic power consumption model may then be represented as:		A high level dynamic power consumption model may then be represented as::

	Pdyn = f(run) * Voltage^2 * Frequency * Utilisation		Pdyn = f(run) * Voltage^2 * Frequency * Utilisation

	@@ -80,7 +95,7 @@ factors. Therefore, in initial implementation that contribution is
	represented as a constant coefficient. This is a simplification		represented as a constant coefficient. This is a simplification
	consistent with the relative contribution to overall power variation.		consistent with the relative contribution to overall power variation.

	In this simplified representation our model becomes:		In this simplified representation our model becomes::

	Pdyn = Capacitance * Voltage^2 * Frequency * Utilisation		Pdyn = Capacitance * Voltage^2 * Frequency * Utilisation

Documentation/thermal/exynos_thermal→Documentation/thermal/exynos_thermal.rst

+30 −17

Original line number	Original line	Diff line number	Diff line
			========================
	Kernel driver exynos_tmu		Kernel driver exynos_tmu
	=================		========================

	Supported chips:		Supported chips:

	* ARM SAMSUNG EXYNOS4, EXYNOS5 series of SoC		* ARM SAMSUNG EXYNOS4, EXYNOS5 series of SoC

	Datasheet: Not publicly available		Datasheet: Not publicly available

	Authors: Donggeun Kim <dg77.kim@samsung.com>		Authors: Donggeun Kim <dg77.kim@samsung.com>
	@@ -19,25 +22,32 @@ Temperature can be taken from the temperature code.
	There are three equations converting from temperature to temperature code.		There are three equations converting from temperature to temperature code.

	The three equations are:		The three equations are:
	1. Two point trimming		1. Two point trimming::

	Tc = (T - 25) * (TI2 - TI1) / (85 - 25) + TI1		Tc = (T - 25) * (TI2 - TI1) / (85 - 25) + TI1

	2. One point trimming		2. One point trimming::

	Tc = T + TI1 - 25		Tc = T + TI1 - 25

	3. No trimming		3. No trimming::

	Tc = T + 50		Tc = T + 50

	Tc: Temperature code, T: Temperature,		Tc:
	TI1: Trimming info for 25 degree Celsius (stored at TRIMINFO register)		Temperature code, T: Temperature,
			TI1:
			Trimming info for 25 degree Celsius (stored at TRIMINFO register)
	Temperature code measured at 25 degree Celsius which is unchanged		Temperature code measured at 25 degree Celsius which is unchanged
	TI2: Trimming info for 85 degree Celsius (stored at TRIMINFO register)		TI2:
			Trimming info for 85 degree Celsius (stored at TRIMINFO register)
	Temperature code measured at 85 degree Celsius which is unchanged		Temperature code measured at 85 degree Celsius which is unchanged

	TMU(Thermal Management Unit) in EXYNOS4/5 generates interrupt		TMU(Thermal Management Unit) in EXYNOS4/5 generates interrupt
	when temperature exceeds pre-defined levels.		when temperature exceeds pre-defined levels.
	The maximum number of configurable threshold is five.		The maximum number of configurable threshold is five.
	The threshold levels are defined as follows:		The threshold levels are defined as follows::

	Level_0: current temperature > trigger_level_0 + threshold		Level_0: current temperature > trigger_level_0 + threshold
	Level_1: current temperature > trigger_level_1 + threshold		Level_1: current temperature > trigger_level_1 + threshold
	Level_2: current temperature > trigger_level_2 + threshold		Level_2: current temperature > trigger_level_2 + threshold
	@@ -54,24 +64,27 @@ it can be used to synchronize the cooling action.
	TMU driver description:		TMU driver description:
	-----------------------		-----------------------

	The exynos thermal driver is structured as,		The exynos thermal driver is structured as::

	Kernel Core thermal framework		Kernel Core thermal framework
	(thermal_core.c, step_wise.c, cpu_cooling.c)		(thermal_core.c, step_wise.c, cpu_cooling.c)
	^		^
	\|		\|
	\|		\|
	TMU configuration data -------> TMU Driver <------> Exynos Core thermal wrapper		TMU configuration data -----> TMU Driver <----> Exynos Core thermal wrapper
	(exynos_tmu_data.c) (exynos_tmu.c) (exynos_thermal_common.c)		(exynos_tmu_data.c) (exynos_tmu.c) (exynos_thermal_common.c)
	(exynos_tmu_data.h) (exynos_tmu.h) (exynos_thermal_common.h)		(exynos_tmu_data.h) (exynos_tmu.h) (exynos_thermal_common.h)

	a) TMU configuration data: This consist of TMU register offsets/bitfields		a) TMU configuration data:
			This consist of TMU register offsets/bitfields
	described through structure exynos_tmu_registers. Also several		described through structure exynos_tmu_registers. Also several
	other platform data (struct exynos_tmu_platform_data) members		other platform data (struct exynos_tmu_platform_data) members
	are used to configure the TMU.		are used to configure the TMU.
	b) TMU driver: This component initialises the TMU controller and sets different		b) TMU driver:
			This component initialises the TMU controller and sets different
	thresholds. It invokes core thermal implementation with the call		thresholds. It invokes core thermal implementation with the call
	exynos_report_trigger.		exynos_report_trigger.
	c) Exynos Core thermal wrapper: This provides 3 wrapper function to use the		c) Exynos Core thermal wrapper:
			This provides 3 wrapper function to use the
	Kernel core thermal framework. They are exynos_unregister_thermal,		Kernel core thermal framework. They are exynos_unregister_thermal,
	exynos_register_thermal and exynos_report_trigger.		exynos_register_thermal and exynos_report_trigger.

Documentation/thermal/exynos_thermal_emulation→Documentation/thermal/exynos_thermal_emulation.rst

+61 −0

Original line number	Original line	Diff line number	Diff line
	EXYNOS EMULATION MODE		=====================
	========================		Exynos Emulation Mode
			=====================

	Copyright (C) 2012 Samsung Electronics		Copyright (C) 2012 Samsung Electronics

	@@ -8,30 +9,37 @@ Written by Jonghwa Lee <jonghwa3.lee@samsung.com>
	Description		Description
	-----------		-----------

	Exynos 4x12 (4212, 4412) and 5 series provide emulation mode for thermal management unit.		Exynos 4x12 (4212, 4412) and 5 series provide emulation mode for thermal
	Thermal emulation mode supports software debug for TMU's operation. User can set temperature		management unit. Thermal emulation mode supports software debug for
	manually with software code and TMU will read current temperature from user value not from		TMU's operation. User can set temperature manually with software code
	sensor's value.		and TMU will read current temperature from user value not from sensor's
			value.

	Enabling CONFIG_THERMAL_EMULATION option will make this support available.		Enabling CONFIG_THERMAL_EMULATION option will make this support
	When it's enabled, sysfs node will be created as		available. When it's enabled, sysfs node will be created as
	/sys/devices/virtual/thermal/thermal_zone'zone id'/emul_temp.		/sys/devices/virtual/thermal/thermal_zone'zone id'/emul_temp.

	The sysfs node, 'emul_node', will contain value 0 for the initial state. When you input any		The sysfs node, 'emul_node', will contain value 0 for the initial state.
	temperature you want to update to sysfs node, it automatically enable emulation mode and		When you input any temperature you want to update to sysfs node, it
	current temperature will be changed into it.		automatically enable emulation mode and current temperature will be
	(Exynos also supports user changeable delay time which would be used to delay of		changed into it.
	changing temperature. However, this node only uses same delay of real sensing time, 938us.)

	Exynos emulation mode requires synchronous of value changing and enabling. It means when you		(Exynos also supports user changeable delay time which would be used to
	want to update the any value of delay or next temperature, then you have to enable emulation		delay of changing temperature. However, this node only uses same delay
	mode at the same time. (Or you have to keep the mode enabling.) If you don't, it fails to		of real sensing time, 938us.)
	change the value to updated one and just use last succeessful value repeatedly. That's why
	this node gives users the right to change termerpature only. Just one interface makes it more		Exynos emulation mode requires synchronous of value changing and
	simply to use.		enabling. It means when you want to update the any value of delay or
			next temperature, then you have to enable emulation mode at the same
			time. (Or you have to keep the mode enabling.) If you don't, it fails to
			change the value to updated one and just use last succeessful value
			repeatedly. That's why this node gives users the right to change
			termerpature only. Just one interface makes it more simply to use.

	Disabling emulation mode only requires writing value 0 to sysfs node.		Disabling emulation mode only requires writing value 0 to sysfs node.

			::


	TEMP 120 \|		TEMP 120 \|
	\|		\|

Documentation/thermal/index.rst

0 → 100644

+18 −0

Original line number	Original line	Diff line number	Diff line
			:orphan:

			=======
			Thermal
			=======

			.. toctree::
			:maxdepth: 1

			cpu-cooling-api
			sysfs-api
			power_allocator

			exynos_thermal
			exynos_thermal_emulation
			intel_powerclamp
			nouveau_thermal
			x86_pkg_temperature_thermal

Documentation/thermal/intel_powerclamp.txt→Documentation/thermal/intel_powerclamp.rst

+93 −90

Original line number	Original line	Diff line number	Diff line
	=======================		=======================
	INTEL POWERCLAMP DRIVER		Intel Powerclamp Driver
	=======================		=======================
	By: Arjan van de Ven <arjan@linux.intel.com>
	Jacob Pan <jacob.jun.pan@linux.intel.com>

	Contents:		By:
			- Arjan van de Ven <arjan@linux.intel.com>
			- Jacob Pan <jacob.jun.pan@linux.intel.com>

			.. Contents:

	(*) Introduction		(*) Introduction
	- Goals and Objectives		- Goals and Objectives

	@@ -23,7 +26,6 @@ Contents:
	- Generic Thermal Layer (sysfs)		- Generic Thermal Layer (sysfs)
	- Kernel APIs (TBD)		- Kernel APIs (TBD)

	============
	INTRODUCTION		INTRODUCTION
	============		============

	@@ -47,7 +49,6 @@ scalability, and user experience. In many cases, clear advantage is
	shown over taking the CPU offline or modulating the CPU clock.		shown over taking the CPU offline or modulating the CPU clock.


	===================
	THEORY OF OPERATION		THEORY OF OPERATION
	===================		===================

	@@ -57,7 +58,8 @@ Idle Injection
	On modern Intel processors (Nehalem or later), package level C-state		On modern Intel processors (Nehalem or later), package level C-state
	residency is available in MSRs, thus also available to the kernel.		residency is available in MSRs, thus also available to the kernel.

	These MSRs are:		These MSRs are::

	#define MSR_PKG_C2_RESIDENCY 0x60D		#define MSR_PKG_C2_RESIDENCY 0x60D
	#define MSR_PKG_C3_RESIDENCY 0x3F8		#define MSR_PKG_C3_RESIDENCY 0x3F8
	#define MSR_PKG_C6_RESIDENCY 0x3F9		#define MSR_PKG_C6_RESIDENCY 0x3F9
	@@ -96,6 +98,8 @@ are not masked. Tests show that the extra wakeups from scheduler tick
	have a dramatic impact on the effectiveness of the powerclamp driver		have a dramatic impact on the effectiveness of the powerclamp driver
	on large scale systems (Westmere system with 80 processors).		on large scale systems (Westmere system with 80 processors).

			::

	CPU0		CPU0
	____________ ____________		____________ ____________
	kidle_inject/0 \| sleep \| mwait \| sleep \|		kidle_inject/0 \| sleep \| mwait \| sleep \|
	@@ -158,7 +162,8 @@ Compensation to each target ratio consists of two parts:
	slowing down CPU activities.		slowing down CPU activities.

	A debugfs file is provided for the user to examine compensation		A debugfs file is provided for the user to examine compensation
	progress and results, such as on a Westmere system.		progress and results, such as on a Westmere system::

	[jacob@nex01 ~]$ cat		[jacob@nex01 ~]$ cat
	/sys/kernel/debug/intel_powerclamp/powerclamp_calib		/sys/kernel/debug/intel_powerclamp/powerclamp_calib
	controlling cpu: 0		controlling cpu: 0
	@@ -217,9 +222,8 @@ keeps track of clamping kernel threads, even after they are migrated
	to other CPUs, after a CPU offline event.		to other CPUs, after a CPU offline event.


	=====================
	Performance Analysis		Performance Analysis
	=====================		====================
	This section describes the general performance data collected on		This section describes the general performance data collected on
	multiple systems, including Westmere (80P) and Ivy Bridge (4P, 8P).		multiple systems, including Westmere (80P) and Ivy Bridge (4P, 8P).

	@@ -257,11 +261,10 @@ achieve up to 40% better performance per watt. (measured by a spin
	counter summed over per CPU counting threads spawned for all running		counter summed over per CPU counting threads spawned for all running
	CPUs).		CPUs).

	====================
	Usage and Interfaces		Usage and Interfaces
	====================		====================
	The powerclamp driver is registered to the generic thermal layer as a		The powerclamp driver is registered to the generic thermal layer as a
	cooling device. Currently, it’s not bound to any thermal zones.		cooling device. Currently, it’s not bound to any thermal zones::

	jacob@chromoly:/sys/class/thermal/cooling_device14$ grep . *		jacob@chromoly:/sys/class/thermal/cooling_device14$ grep . *
	cur_state:0		cur_state:0
	@@ -278,9 +281,9 @@ cur_state returns value -1 instead of 0 which is to avoid confusing
	100% busy state with the disabled state.		100% busy state with the disabled state.

	Example usage:		Example usage:
	- To inject 25% idle time		- To inject 25% idle time::

	$ sudo sh -c "echo 25 > /sys/class/thermal/cooling_device80/cur_state		$ sudo sh -c "echo 25 > /sys/class/thermal/cooling_device80/cur_state
	"

	If the system is not busy and has more than 25% idle time already,		If the system is not busy and has more than 25% idle time already,
	then the powerclamp driver will not start idle injection. Using Top		then the powerclamp driver will not start idle injection. Using Top
	@@ -292,7 +295,7 @@ idle time is accounted as normal idle in that common code path is
	taken as the idle task.		taken as the idle task.

	In this example, 24.1% idle is shown. This helps the system admin or		In this example, 24.1% idle is shown. This helps the system admin or
	user determine the cause of slowdown, when a powerclamp driver is in action.		user determine the cause of slowdown, when a powerclamp driver is in action::


	Tasks: 197 total, 1 running, 196 sleeping, 0 stopped, 0 zombie		Tasks: 197 total, 1 running, 196 sleeping, 0 stopped, 0 zombie