Commit effe8db0 authored by Bryan Brattlof's avatar Bryan Brattlof Committed by Daniel Lezcano
Browse files

dt-bindings: thermal: k3-j72xx: elaborate on binding description 



Elaborate on the function of this device node as well as some of the
properties this node uses.

Signed-off-by: default avatarBryan Brattlof <bb@ti.com>
Acked-by: default avatarKrzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20221031232702.10339-6-bb@ti.com


Signed-off-by: default avatarDaniel Lezcano <daniel.lezcano@kernel.org>
parent 366444eb

Documentation/devicetree/bindings/thermal/ti,j72xx-thermal.yaml

+18 −1
Original line number Diff line number Diff line
@@ -9,6 +9,19 @@ title: Texas Instruments J72XX VTM (DTS) binding 
maintainers:

  - Keerthy <j-keerthy@ti.com>



description: |

  The TI K3 family of SoCs typically have a Voltage & Thermal

  Management (VTM) device to control up to 8 temperature diode

  sensors to measure silicon junction temperatures from different

  hotspots of the chip as well as provide temperature, interrupt

  and alerting information.



  The following polynomial equation can then be used to convert

  value returned by this device into a temperature in Celsius



  Temp(C) = (-9.2627e-12) * x^4 + (6.0373e-08) * x^3 + \

            (-1.7058e-04) * x^2 + (3.2512e-01) * x   + (-4.9003e+01)



properties:

  compatible:

    enum:
@@ -19,7 +32,11 @@ properties: 
    items:

      - description: VTM cfg1 register space

      - description: VTM cfg2 register space

      - description: VTM efuse register space

      - description: |

          A software trimming method must be applied to some Jacinto

          devices to function properly. This eFuse region provides

          the information needed for these SoCs to report

          temperatures accurately.



  power-domains:

    maxItems: 1