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Infineon's multi-chip package (MCP) devices require the octal DTR configuration to be set for each die. Split common code in dedicated methods to ease the octal DDR MCP support addition. Signed-off-by:Takahiro Kuwano <Takahiro.Kuwano@infineon.com> Link: https://lore.kernel.org/r/20230726075257.12985-4-tudor.ambarus@linaro.org Signed-off-by:
Tudor Ambarus <tudor.ambarus@linaro.org>